Specifikācija
Modelis | B760 GAMING PLUS WIFI |
Mikroshēmu kopums | Intel B760 Express |
Sokets | LGA1700 |
Formas faktors | ATX |
Atmiņas tips | DDR5 |
Frekvences ātrums | 4800/5000/5200/5400/5600/5800/6000/6200/6400/6600/6800 MHz |
Atmiņas sloti | 4 |
M.2 | 2 |
PCI-Express 16x | 5 |
Audio ports | 5 |
DisplayPort | 1 |
HDMI | 1 |
Optiskais S/PDIF | 1 |
PS/2 | 1 |
RJ45 | 1 |
USB 2.0 | 2 |
USB 3.2 | 2 |
USB-C | 1 |
Bluetooth | Jā |
USB 2.0 | Jā |
USB 3.2 | Jā |
WiFi | Jā |
Integrēta video | Depending on CPU |
Integrēts LAN | 2.5 Gigabit |
Integrēta audio | Realtek ALC897 |
RAID | SATA 0, 1, 5, 10 |
TPM | Header |
Nosūtīšanas kastes daudzums | 1 |
Nosūtīšanas kastes dziļums | 35 cm |
Nosūtīšanas kastes augstums | 7 cm |
Nosūtīšanas kastes svars | 1.49 kg |
Nosūtīšanas kastes platums | 27.2 cm |
Vienības bruto tilpums | 0.006664 cubm |
Vienības neto svars | 1.2 kg |
Vienības bruto svars | 1.49 kg |
Vienības kastes platums | 0.272 |
Vienības kastes garums | 0.35 |
Vienības kastes augstums | 0.07 |
Apraksts
- Supports 12th/13th Gen Intel® Core™, Pentium® Gold and Celeron® processors for LGA 1700 socket
- Supports DDR5 Memory, Dual Channel DDR5 6800+MHz (OC)
- Enhanced Power Design: 12+1 Duet Rail Power System with P-PAK, 8-pin + 4-pin CPU power connectors, Core Boost, Memory Boost
- Premium Thermal Solution: Extended Heatsink, MOSFET thermal pads rated for 7W/mK, additional choke thermal pads are built for high performance system and non-stop gaming experience
- Lightning Fast Game experience: PCIe 4.0 slot, Lightning Gen 4 x4 M.2 with M.2 Shield Frozr, Turbo USB 3.2 Gen 2 10G
- 2.5G LAN with Wi-Fi 6E Solution: Upgraded network solution for professional and multimedia use. Delivers a secure, stable and fast network connection
- High Quality PCB: 6-layer PCB made by 2oz thickened copper
- Audio Boost: Reward your ears with studio grade sound quality for the most immersive gaming experience
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