Specifikācija
| Modelis | B760 DS3H AX 1.1 |
| Mikroshēmu kopums | Intel B760 Express |
| Sokets | LGA1700 |
| Formas faktors | ATX |
| Atmiņas tips | DDR5 |
| Frekvences ātrums | 4000/4800/5200/5400/5600/5800/6000/6200/6400/6600/6800/7000/7200/7400/7600 MHz |
| Atmiņas sloti | 4 |
| M.2 | 2 |
| PCI-Express 3.0 1x | 4 |
| PCI-Express 4.0 16x | 1 |
| Audio ieeja | 2 |
| Audio izvade | 1 |
| DisplayPort | 1 |
| HDMI | 1 |
| PS/2 | 1 |
| RF-Izvade | 2 |
| RJ45 | 1 |
| USB 2.0 | 4 |
| USB 3.2 | 1 |
| USB-C | 1 |
| Bluetooth | Jā |
| SATA | Jā |
| WiFi | Jā |
| Integrēta video | Jā |
| Integrēts LAN | Gigabit |
| Integrēta audio | Jā |
| RAID | SATA 0, 1, 5, 10 |
| TPM | Header |
| Nosūtīšanas kastes daudzums | 1 |
| Nosūtīšanas kastes dziļums | 34 cm |
| Nosūtīšanas kastes augstums | 8.5 cm |
| Nosūtīšanas kastes svars | 1.35 kg |
| Nosūtīšanas kastes platums | 27 cm |
| Vienības bruto tilpums | 0.007803 cubm |
| Vienības neto svars | 0.9 kg |
| Vienības bruto svars | 1.35 kg |
| Vienības kastes platums | 0.27 |
| Vienības kastes garums | 0.34 |
| Vienības kastes augstums | 0.085 |
Apraksts
- Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
- Unparalleled Performance:Hybrid 8+2+1 Phases Digital VRM Solution
- Dual Channel DDR5:4*DIMMs XMP Memory Module Support
- Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
- EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design
- Fast Networks:GbE LAN & Wi-Fi 6E 802.11ax
- Extended Connectivity:Rear USB-C® 20Gb/s, DP, HDMI
- Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card