Parastā cena
€102,98
Parastā cena
Izpārdošanas cena
€102,98
Specifikācija
Modelis | B760M DS3H DDR4 |
Mikroshēmu kopums | Intel B760 Express |
Sokets | LGA1700 |
Formas faktors | Micro-ATX |
Atmiņas tips | DDR4 |
Frekvences ātrums | 2133/2400/2666/2933/3000/3200/3300/3333/3400/3466/3600/3666/3733/3800/4000/4133/4266/4300/4400/4500/4600/4700/4800/4933/5000/5133/5333 MHz |
Atmiņas sloti | 4 |
M.2 | 2 |
PCI-Express 3.0 1x | 2 |
PCI-Express 4.0 16x | 1 |
15 pin D-sub | 1 |
Audio ports | 3 |
DisplayPort | 2 |
HDMI | 1 |
PS/2 | 1 |
RJ45 | 1 |
USB 2.0 | 2 |
USB 3.2 | 3 |
USB-C | 1 |
SATA | Jā |
USB 2.0 | Jā |
USB 3.2 | Jā |
Integrēta video | Depending on CPU |
Integrēts LAN | 2.5 Gigabit |
Integrēta audio | Jā |
RAID | SATA 0, 1, 5, 10 |
TPM | Header |
Nosūtīšanas kastes daudzums | 1 |
Nosūtīšanas kastes dziļums | 27 cm |
Nosūtīšanas kastes augstums | 27 cm |
Nosūtīšanas kastes svars | 0.92 kg |
Nosūtīšanas kastes platums | 5.5 cm |
Vienības bruto tilpums | 0.00401 cubm |
Vienības neto svars | 0.75 kg |
Vienības bruto svars | 0.92 kg |
Vienības kastes platums | 0.055 |
Vienības kastes garums | 0.27 |
Vienības kastes augstums | 0.27 |
Apraksts
- Intel® Socket LGA 1700:Support 13th and 12th Gen Series Processors
- Unparalleled Performance:Hybrid 6+2+1 Phases Digital VRM Solution
- Dual Channel DDR4:4*DIMMs XMP Memory Module Support
- Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
- M.2 Thermal Guard:To Ensure M.2 SSD Performance
- EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design
- Fast Networks:2.5GbE LAN
- Extended Connectivity:Rear USB-C® 10Gb/s, DP, HDMI
- Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
- Choosing a selection results in a full page refresh.