Parastā cena
€136,91
Parastā cena
Izpārdošanas cena
€136,91
Specifikācija
Modelis | B760 DS3H AX DDR4 1.2 |
Mikroshēmu kopums | Intel B760 Express |
Sokets | LGA1700 |
Formas faktors | ATX |
Atmiņas tips | DDR4 |
Frekvences ātrums | 2133/2400/2666/2933/3000/3200/3300/3333/3400/3466/3600/3666/3733/3800/3866/4000/4133/4266/4300/4400/4500/4600/4700/4800/4933/5000/5133/5333 MHz |
Atmiņas sloti | 4 |
M.2 | 2 |
PCI-Express 3.0 1x | 4 |
PCI-Express 4.0 16x | 1 |
Audio ieeja | 2 |
Audio izvade | 1 |
DisplayPort | 1 |
HDMI | 1 |
PS/2 | 1 |
RF-Izvade | 2 |
RJ45 | 1 |
USB 2.0 | 4 |
USB 3.2 | 1 |
USB-C | 1 |
Bluetooth | Jā |
SATA | Jā |
WiFi | Jā |
Integrēta video | Jā |
Integrēts LAN | Gigabit |
Integrēta audio | Jā |
RAID | SATA 0, 1, 5, 10 |
TPM | Header |
Nosūtīšanas kastes daudzums | 1 |
Nosūtīšanas kastes dziļums | 34 cm |
Nosūtīšanas kastes augstums | 8.5 cm |
Nosūtīšanas kastes svars | 1.26 kg |
Nosūtīšanas kastes platums | 27.5 cm |
Vienības bruto tilpums | 0.007947 cubm |
Vienības neto svars | 0.9 kg |
Vienības bruto svars | 1.26 kg |
Vienības kastes platums | 0.275 |
Vienības kastes garums | 0.34 |
Vienības kastes augstums | 0.085 |
Apraksts
- Intel Socket LGA 1700:Support 13th and 12th Gen Series Processors
- Unparalleled Performance:Hybrid 8+2+1 Phases Digital VRM Solution
- Dual Channel DDR4:4*DIMMs XMP Memory Module Support
- Next Generation Storage:2*PCIe 4.0 x4 M.2 Connectors
- EZ-Latch:PCIe 4.0x16 Slot with Quick Release Design
- Fast Networks:GbE LAN & Wi-Fi 6E 802.11ax
- Extended Connectivity:Rear USB-C® 20Gb/s, DP, HDMI
- Smart Fan 6:Features Multiple Temperature Sensors, Hybrid Fan Headers with FAN STOP
- Q-Flash Plus:Update BIOS Without Installing the CPU, Memory and Graphics Card
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