Specifikācija
Modelis | X670E AORUS MASTER (rev. 1.1) |
Mikroshēmu kopums | AMD X670 |
Sokets | SAM5 |
Formas faktors | EATX |
Atmiņas tips | DDR5 |
Frekvences ātrums | 4400/4800/5200 MHz |
Atmiņas sloti | 4 |
M.2 | 4 |
PCI-Express 3.0 2x | 1 |
PCI-Express 4.0 4x | 1 |
PCI-Express 5.0 16x | 1 |
Audio ieeja | 1 |
Audio izvade | 1 |
DisplayPort | 1 |
HDMI | 1 |
Optiskais S/PDIF | 1 |
RF-Izvade | 2 |
RJ45 | 1 |
USB 2.0 | 2 |
USB 3.2 | 4 |
USB-C | 2 |
SATA | Jā |
Integrēta video | Jā |
Integrēta audio | Jā |
Integrēts LAN | 2.5 Gigabit |
RAID | SATA 0, 1, 10 |
TPM | Header |
Nosūtīšanas kastes daudzums | 4 |
Nosūtīšanas kastes dziļums | 41 cm |
Nosūtīšanas kastes augstums | 36.5 cm |
Nosūtīšanas kastes svars | 13.3 kg |
Nosūtīšanas kastes platums | 33.5 cm |
Vienības bruto tilpums | 0.01253 cubm |
Vienības neto svars | 1.8 kg |
Vienības bruto svars | 3.33 kg |
Vienības kastes platums | 0.085 |
Vienības kastes garums | 0.345 |
Vienības kastes augstums | 0.295 |
Apraksts
X670E AORUS MASTER (rev. 1.1)
AMD Socket AM5 : Supports AMD Ryzen™ 7000 Series Processors
Unparalleled Performance : Twin 16+2+2 Phases Digital VRM Solution
Dual Channel DDR5 : 4*SMD DIMMs with EXPO & XMP Memory Module Support
Next Generation Storage : 2*PCIe 5.0 x4 and 2*PCIe 4.0 x4 M.2 Connectors
Fins-Array III & M.2 Thermal Guard III : To Ensure VRM Power Stability & 25110 PCIe 5.0 M.2 SSD Performance
EZ-Latch Plus : SMD PCIe 5.0 x16 Slot & M.2 Connectors with Quick Release & Screwless Design
Hi-Fi Audio with DTS : X® Ultra : ALC1220 CODEC
Fast Networks : Intel 2.5GbE LAN & Intel® Wi-Fi 6E 802.11ax
Extended Connectivity : DP, HDMI, USB-C with DP Alt Mode, Dual USB-C 20Gbps and Upcoming GIGABYTE USB4 AIC Support
Q-Flash Plus : Update BIOS Without Installing the CPU, Memory and Graphics Card
* Actual support may vary by CPU.
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